Failure Analysis and Technical Development of Electronic Components
Download PDF
$currentUrl="http://$_SERVER[HTTP_HOST]$_SERVER[REQUEST_URI]"

Keywords

Electronic components
Failure analysis
Technology development

DOI

10.26689/erd.v6i3.6621

Submitted : 2024-03-25
Accepted : 2024-04-09
Published : 2024-04-24

Abstract

The failure analysis involves researching a product to identify its failure mechanism and components. This allows for targeted improvements to prevent subsequent issues and enhance the product’s stability. In the context of electronic component failure analysis, testing and analysis are employed to elucidate the failure process and identify the underlying causes, ensuring the smooth operation of components. This paper introduces some simple and cost-effective analysis methods. During the electronic component failure analysis, sensory examination and internal analysis can aid in judgment. Leveraging extensive analysis experience and utilizing relevant facilities correctly can lead to cost reduction and an increased success rate.

References

Liu S, 2021, Discussion on Failure Mechanism of Electronic Components. Electric Power Equipment Management, 2021(7): 205–206.

Rong Z, Huang Y, 2023, Research on Common Failure Mechanism of MOSFET in Battery Protection Circuit. Electronic Products Reliability and Environmental Testing, 41(2): 21–27.

Liu Y, Tan A, Deng L, et al., 2023, Failure Analysis and Reliability Improvement of Electromagnetic Relays. Proceedings of 2022 China Household Electrical Appliances Technology Conference, 2023: 6.

Yang L, 2018, Failure Mode Impact Analysis Technology of Electronic Components. Computer Fans, 2018(29): 92.

Gao R, Pei X, Xi S, et al., 2023, Failure Analysis of Metal-Aluminum Bonding of Electronic Components. Reliability and Environmental Testing of Electronic Products, 41(6): 74–78.

Fan P, 2022, Electronic Components Failure Analysis and Technology Analysis. Modern Industrial Economy and Information Technology, 12(12): 240–242.

Deng Y, Chen R, 2022, Application of Component Failure Analysis in Nuclear Grade Products. Process Automation Instrumentation, 43(11): 91–94.

Zhou W, 2022, Fault Failure and Cause Analysis of Electronic Component Conductors. Environmental Technology, 40(3): 27–32.

Zhang Y, Cheng Z, Lian G, et al., 2023, Fault Mode Analysis of Electronic Equipment Based on PoF Model and FTA. Modern Defense Technology, 51(4): 86–96.

Chen J, 2022, Automotive Electronic Components Failure Mechanism and Simulation Analysis. Journal of Cars and New Energy, 5(5): 77–79.

Feng L, Hua Z, 2022, Arrival Screening and Quality Control of Electronic Components. Proceedings of 2022 Annual Meeting of Tianjin Electronics Industry Association, 2022: 3.

Luo D, Ni Y, Liang H, et al., 2021, The Past, Present and Future of Failure Analysis of Electronic Components. Electronic Product Reliability and Environmental Test, 39(S2): 8–15.

Li D, 2018, Exploration of the Electronic Components Failure Analysis. Digital Communication World, 2018(11): 245.

Guan W, 2018, Failure Cause Analysis and Solution of Electronic Components. Electric Power System Equipment, 2018(1): 157–158.

Zhang G, 2021, Analysis Method of Failed Electronic Components. Digital Communications World, 2021(1): 120–121 + 94.